 |
OUR CAPABILITIES |
|
|
| |
Minimum Line Width
and Spacing |
.004" |
|
| |
Feature Size Reproducibility |
+/-
20% |
|
| |
Impedance Control Tolerance |
+/- 10% |
|
| |
Panel Size of 18 x 24 - Usable area 16.5" x 22.5" |
|
|
| |
|
|
|
| |
HOLES
( Referencing a Board .062" thick) |
|
|
| |
Minimum
Drill Diameter |
.008" |
|
| |
Tolerance Plated-thru diameter |
+/- .003" |
|
| |
Tolerance Non-plated diameter |
+/- .0015" |
|
| |
Hole placement accuracy |
+/- .003" |
|
| |
|
|
|
| |
LAMINATION |
|
|
| |
Individual
dielectric thickness tolerance |
+/- .002" |
|
| |
Finished board thickness |
+/-
.005" |
|
| |
|
|
|
| |
IMAGE
Placement |
|
|
| |
Minimum
annular ring |
+/- .002" |
|
| |
Photoimagable solder mask registration |
+/- .003" |
|
| |
Wet solder mask registration |
+/- .008" |
|
| |
|
|
|
| |
FABRICATION |
|
|
| |
N.C.
Rout dimensional tolerance |
+/- .005" |
|
| |
Scoring
dimensional tolerance |
+/- .005" |
|
| |
|
|
|
| |
SURFACE
FINISHES |
|
|
| |
Immersion
Nickel/Gold - 100-500µ Ni / 3-8µ Au |
|
|
| |
Entek
Organic Solderability Preservative (O.S.P.) |
|
|
| |
Electroplate
Nickel/Gold - 100-200µ Ni / 30-50µ Au
|
|
|
| |
Hot Air |
|
|
| |
Immersion
Silver |
|
|
| |
Immersion
White Tin |
|
|
| |
|
|
|
| |
IPC
MANUFACTURING SPECIFICATIONS |
|
|
| |
IPC-D-300 |
|
|
| |
IPC-6011 |
|
|
| |
IPC-6012 |
|
|
| |
|
|
|
| |
ELECTRICAL
TESTING |
|
|
| |
Double
Density Clam Shell Net Testing (.008" pitch) |
|
|
| |
ProBot Point-to-Point Testing (.006" pitch ) |
|
|
